Xiaomi Mix Flip design has been revealed

Xiaomi will launch its new Mix Fold 4 and Mix Flip devices on July 19. The latest leak has surfaced the design of the device. This upcoming device may follow the Duatone finish on the back side, and it will be available in three color options: black, White, and Purple. This device can use a dual camera setup with a suspicious periscope lens. 

According to the report, The Xiaomi Mix Flip may come with a hole-punch cutout for the external screen selfie camera and slightly thinner bezels.

The cover screen area is consistent with the two parts with a small screen, and the remaining area includes camera islands. Its outer screen works to show notifications and calls and display wallpapers. 

The top edge of the phone could have two holes for the microphone and an IR Blaster. On the bottom, it would include a SIM slot, USB-C port, microphone, and speakers.

The volume rocker and power key are available on the right side. The device’s camera setup is co-engineered with Leica and houses a Summilux large aperture lens. 

On the other hand, Xiaomi Mix Flip would be powered by the Snapdragon 8 Gen 3 chipset, which pairs the LPDDR5X RAM with UFS 4.0 storage. It will also support the 3D vapor chamber cooling unit for heat dissipation.

It may pack a 4780 mAh battery, which supports 67W fast charging. The Mix Flip would have 12GB/16 GB RAM and up to 1TB of storage. It may be run on the HyperOS. 

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