According to leaks, Xiaomi will include the Dimensity 9300 Plus chipset in some of its new devices this year, such as the Redmi K70 Ultra.
This device may be launched in China in July this year. However, it has been officially confirmed that Xiaomi’s new foldable phones will also be launched in July.
The certification websites have also revealed the features of these devices. A report states that Xiaomi has officially started full-scale production so that we will find the new specifications in the upcoming Xiaomi Mix Fold 4 and Xiaomi Mix Flip foldable.
On the other hand, the Xiaomi Mix Flip 4 and Mix Fold 4 will have the Snapdragon 8 Gen 3 chipset. This Xiaomi Mix Flip will be available in four options: 12/256 GB, 12/512 GB, 16/512GB and 16/1TB. These devices are expected to have an OIS-enabled 50 and 60 MP with 2x telephoto.
This device may also have 67W rapid charging support and a 4-inch outer display. The Xiaomi Mix Fold 4 is expected to have a 50 MP main camera with OIS support, a 12MP ultra-wide lens, a 60 MP telephoto camera with 2x optical zoom, and a 10 MP periscope telephoto camera with 5x optical zoom.
The Mix Fold 4 will have a 5000 mAh battery, which can also support 67W fast charging and wireless charging.
However, the company has not given any other information about these devices. All these are expected to be launched soon, and we will get all the information about them.
